二维超声振动磨削机理与试验研究

吴雁; 孙爱国; 刘永姜; 赵丽琴

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二维超声振动磨削机理与试验研究

更新时间：2026-09-14

- 二维超声振动磨削机理与试验研究
- 二维超声振动磨削机理与试验研究
- Issue 6, (2007)
- 作者机构：
  
  中北大学机械工程与自动化学院
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Published：2007
- 稿件说明：
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吴雁, 孙爱国, 刘永姜, et al. 二维超声振动磨削机理与试验研究[J]. 2007, (6).
DOI：

吴雁, 孙爱国, 刘永姜, et al. 二维超声振动磨削机理与试验研究[J]. 2007, (6). DOI：

摘要

基于单颗磨粒切削运动轨迹仿真模型

定义了单颗磨粒在工件表面的相对运动轨迹为"椭螺线"曲线轨迹.分析了二维超声振动磨削机理

进行了二维超声振动磨削与普通磨削对比试验.试验结果表明:同样磨削条件下

二维超声振动磨削法向力可以减少20%~30%

材料去除率增大近2倍;原子力显微镜(Atomic Force Microscope

AFM)表面微观特性分析表明:二维超声振动磨削表面明显优于普通磨削

具有优良的表面完整性.二维超声振动磨削是一种精密、高效的加工新工艺.

Abstract

Based on the simulation model of grain cutting trace in workpiece two-dimension ultrasonic vibration grinding(WTDUVG)

the grain cutting trace of spiral line was defined and the mechanism of WTDUVG was discussed.Experimental researches of ceramic were carried out both with and without workpiece ultrasonic assistance vibration grinding.Experimental results indicate that Material Removal Rate(MRR) of ultrasonic grinding process is two times as large as that of conventional grinding(CG)

and the grinding force in WTDUVG is about 20%～30% less than that in conventional grinding.Ultrasonic vibration grinding surface has no spur and build-up edge and its roughness is smaller than CG significantly.The study shows that ultrasonic vibration grinding is a precise and highly efficient method for the machining of ceramic composites.

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