A practical packaging structure was designed for the designed MEMS high measure range accelerometer

and encapsulation performance was simulated when it used potting.By the result of simulation

the packaging structure can meet the requirements of sensor

which can test the available signal under 200 000 g impact loads.From the results of modal and static simulation

potting can not only improve the natural frequency of the package model

but also can reduce the stress when shock load effected on the model.Elastic moduli of the potting materials have the great influence on the package performance

but the density has little effect on it.The simulation results also show that the modal frequency of the package model increases with modulus increases

while the stress reduce when the same load on the package model.However

the modal frequency is much smaller than the packaging structure without potting when the elastic modulus was too small

which may bring a distortion of the sensor output signal.